Semiconductor Fabrication

Semiconductor Fabrication Capabilities:
Microelectronics Integration program develops processes, operates and/or maintains the following processing capabilities:

  1. Photolithography – Contact and Stepper
  2. Plasma Enhanced Chemical Vapor Deposition (PECVD)
  3. Deep Reactive Ion Etching (DRIE)
  4. Magnetic = 0 Resonant Induction (m0RI)
  5. Wet etch
  6. Al/Ti/Cu Physical Vapor Deposition (PVD – Sputtering)
  7. Electroplating
  8. Metal evaporation
  9. Polyimide processing
  10. Wafer bonding
  11. Submicron Through Silicon Vias (TSVs)
  12. Si wafer backgrind
  13. Si bulk etch
  14. Damascene processing
  15. Thin-films metrology
  16. Wafer bow/stress measurement and engineering
  17. Auto inspection and defect detection



Please feel free to contact the MI team to discuss any of these technologies in depth.