Principle Investigators:

Dr. Michael Khbeis is the Technology Mission Leader for R3 Microelectronics Integration program.  Dr. Khbeis has been active in semiconductor manufacturing since 1997 while working at Matsushita Semiconductor Corporation of America (MASCA - Panasonic) in the production of Dynamic Random Access Memory (DRAM) and Application Specific Integrated Circuits (ASICs).  While at MASCA, Dr. Khbeis focused on wet/dry etch processing, Critical Dimension (CD) Scanning Electron Microscope (SEM) analysis, hazardous materials (HAZMAT) handling, was an active member of the Emergency Response Team (ERT), and aided in decommissioning/environmental testing of the MASCA facility until 2000.  Dr. Khbeis completed a BS in Electrical Engineering from University of Washington in 2001 and joined the R3 at the Laboratory for Physical Sciences upon graduation in which he focused on development of 3-D Integration processes, pioneering the first sub-micron TSVs and die-to-wafer integration, thinning, and COTS depackaging methodologies.  In parallel, Dr. Khbeis completed a MS (2007) and PhD (2010) in Electrical Engineering at the University of Maryland while focusing on MEMS-based energy scavenging techniques.  Dr. Khbeis initiated the development of High Density Substrate work in late 2008 and became Technology Mission Leader of the Microelectronics Integration program in 2009 to continue the development of custom microfabrication techniques and high density prototypes.

 

Dr. Douglas Ketchum is a Senior Chemist/Process Engineer at the Laboratory for Physical Sciences (LPS) in the Microelectronics Integration program.   His primary responsibility is the development of high density Thin Film Interconnect (TFI) flexible substrates for use in low profile applications.  Prior to joining the LPS, Dr. Ketchum spent five years working in the field of Microelectronic Anti-Tamper and Protective Technologies, preceded by three years at the  Microelectronics Research Laboratory (MRL) focusing on fabrication processes for Flip Chip packaging and Chip-on-Flex technologies.  Dr. Ketchum received a Bachelor of Arts in Chemistry from The College of Wooster in 1991, and Master of Science and Ph.D. degrees in Chemistry from The Ohio State University in 1994 and 1997, respectively.  Dr. Ketchum was a Postdoctoral Fellow at Clemson University from 1998 through 2000 working on the growth of Group III nitrides in supercritical fluids and the synthesis of metal pentatelluride and quasicrystal compounds as potential thermoelectric materials.

 

Mr. Debtanu Basu is a Senior Chemist/Process Engineer at the Laboratory for Physical Sciences (LPS) in the Microelectronics Integration program.  His primary focus is in advanced packaging for high density substrates and prototype and volume Printed Circuit Boards (PCB) assembly.   Mr. Basu started his career in advanced packaging in 1997, as a Process Engineer in International Micro Industries, New Jersey. While working at IMI, Mr. Basu was engaged in contract production research, manufacturing and packaging for the semiconductor and electronics industry. In this effect he concentrated in the advanced semiconductor chip assembly and packaging technologies of Wafer Bumping, Chip on Glass (COG), Flip Chip and Tape Carrier Packages for flat panel display, CSP, Ink Jet Print heads and other chip based microelectronic product market. In 1999 Mr. Basu joined Semtech Corporation, Texas, as a Development Engineer, where he concentrated on process development for first flip chip TVS diode array. He also took a lead role in bringing in-house capability for manufacturing wafer level chip scale packages for TVS devices. In 2001 Mr. Basu moved to Lucent Technologies as a Process Development Engineer for optoelectronics packaging. In this role he focused on module assemblies for 40 gig receiver, 10 gig Ethernet transceivers and MEMS optical switches. He worked there until the Agere Systems spin-off resulting in closing of the facility. In 2003 Mr. Basu moved to York University, Toronto as a Ph. D student (not completed), where his focus was on Surface Magneto Optic Kerr Effect for electro deposited multi-layers for constructing Giant Magneto Resistance (GMR) devices. Since 2008 Mr. Basu has worked for University Research Foundation as a staff researcher at LPS.  Mr. Basu received his BS (1989) and MS (1991) in Chemistry from the Indian Institute of Technology and MS in Chemistry from University of Rhode Island in 1995.

 

Ms. Mary Bridge is a Junior Chemist/Process Engineer at the Laboratory for Physical Sciences (LPS) in the Microelectronics Integration program. Her primary focus is on back-end-of the line (BEOL) microelectronics processing and process development of for High Density Substrate (HDS) prototypes manufacturing.  She received her BS in Chemistry with a specialization in Physical Chemistry and a minor in Applied Mathematics in 2008 from Radford University. Since then, she has worked for the University of Maryland at the Laboratory of Physical Sciences (LPS) as a research member of the Microelectronics Integration group.  She is pursuing a M.S. in Technology Management at the University of Maryland in College Park in parallel to her work at LPS.

 

Mr. de la Vergne is the Lead Support Engineer at the Laboratory for Physical Sciences (LPS) in the Microelectronics Integration program.  He started his career with a 6-year enlistment in the U.S. Navy as a Fire Control Technician Gun Fire Control working on Mk116 Mod 6&8 Gun Fire computers. Mr. de la Vergne then went to work in the Bahamas on Andros Island at the Atlantic Undersea Test and Evaluation Center for 3 years as an Installation and Maintenance Engineer for Mk 30 Mod 0 target torpedoes. Mr. de la Vergne’s first semiconductor-centric position was Analog Devices Wilmington, MA as an Associate Equipment Engineer in the Wet and Dry Plasma Etching systems. Mr. de la Vergne also worked for Lam Research Corporation as a Field Service Engineer for the Rainbow Dry Etch Platforms as well as legacy platforms. Mr. de la Vergne owned his own business as an Independent Sales Representative for a mix of Semiconductor product lines that included both equipment and consumables and acted as an independent Field Service Engineer for CHA Industries and AmTec Automation. Mr. de la Vergne then went to work for CHA industries as a full-time Field Service Engineer with the East coast as primary service area but provided global support as needed.  In 2005, Mr. de la Vergne’s started his current position at the University of Maryland as a Member of the Technical Staff overseeing a wide range of equipment types and infrastructure and Cleanroom support areas.

 

Mr. Kevin Usher is a Support Engineer at the Laboratory for Physical Sciences (LPS) in the Microelectronics Integration program.  He started his career in the Semiconductor Industry in 1984 as a Field Service Engineer for Electrotech, Inc. There Mr. Usher installed, supported, and trained customers in the USA on PVD, CVD and Etch Products. When Electrotech merged with PMT, Inc to form Trikon Technologies, Inc, Mr. Usher continued his role as a US Field Service Engineer until 2001, when he became East Coast Field Service Manager for Trikon.  In this position he was responsible for managing 5 Field Service Engineers while also still supporting customers in the field. This included site visits, writing contract proposals, spare packages and overseeing large capital tool installations. Trikon then merged with Aviza in 2005 to form Aviza Technologies. Mr. Usher continued his role as Field Service manager with even more responsibilities, customers and additional products to oversee, ALD and Furnaces for US operations. Mr. Usher then went to work for Triquint Semiconductor in 2008 as an Equipment Engineer, responsible for maintaining all processing equipment in a production environment. Mr. Usher is currently working at the University of Maryland as a member of the technical staff, supporting the most sensitive and critical equipment the LPS uses for BEOL and TSV fabrication.