Projects / High Density Substrates

Project Overview:

The High Density Substrates (HDS) project uses silicon processing to create thin multi-chip modules (MCMs) that use thinned COTS die, within epoxy or thermoplastic matrix as the rigid substrate.  This enables the fabrication of ultra-thin rigid modules that are only limited in thickness by the specification of the solder ball diameters at the top and bottom interfaces and the desired component thicknesses. 

Core Fabrication Technologies:

HDS work starts with a set of customer specifications including desired form factor, chip-to-chip I/O requirements, and a netlist file that defines desired connectivity for the MCM.  R3 design engineers then use a myriad of Electronic Design Automation (EDA) tools to simulate and layout the system using industry tools such as CADENCE Virtuoso XL and Agilent Advanced Design Suite.  Alternatively, R3 can migrate pre-existing designs in Gerber or AutoCAD formats, using conversion tools, to generate a microfabrication mask set for rapid prototyping.

After completion of design, MI uses standardized semiconductor fabrication techniques to form sub-micron precision conductor lines and power planes on multiple layers to create the MCM at a wafer scale.  The tight tolerances permit the fabrication of impedance-matched traces that enable up to 5Ghz signals between components.   Following completion of the multi-layer interconnect, circuit board assembly and advanced packaging techniques are used to complete the module through bare die population, underfill and encapsulating epoxy dispense, wafer thinning, low damage substrate etch, and solder bumping.