Depackaging of Commercial-Off-The-Shelf (COTS) Parts:

R3 uses chemical jet etching to harvest commercial chips for bare die integration work in low volumes.  Most manufacturers will not sell bare die components for orders less than $100K, so in order to enable prototype development; R3 devised a reliable way to extract commercial parts for integration into compact, specialized systems.  Currently, R3 can extract any part in plastic and Ball Grid Array (BGA) interposer packages with better than 90-percent yield.  It should be noted that some parts are more sensitive than others to the presence of harsh corrosive chemicals, so some baseline experimentation is required in order to achieve acceptable harvesting yields. 
Key depackaging compatibility concerns stem from manufacturer utilization of unique Under Bump Metallization (UBM) alloys for contact pads and polymer-based protective coatings, such as Benzocyclobutane (BCB) and polyimide that are subject to severe attack even for short durations.  MI engineers mitigate these challenges by tightly controlling the ambient environment and post-etch chemical processes that the die are exposed to during the entire process.  Today, R3 regularly depackages high-performance components such as Xilinx Field Programmable Gate Arrays (FPGAs), Texas Instruments Radios, STMicrosystems Flash memories, and much more.

Following the depackaging process, the bare ICs are thoroughly cleaned, inspected, and electrically tested when possible.  Bare die are either directly bonded using pre-existing gold studs or solder BGA or reworked into flip-chip parts through solder deposition.  Alternatively, the die can be directly integrated into a system or remapped to an alternative layout using a redistribution layer (RDL).  Please feel free to contact us to address your operational needs for low volume bare die components.