Advanced Packaging

Advanced Packaging Capabilities:
Microelectronics Integration program develops processes, operates and/or maintains the following processing capabilities:

    • Stencil printing
    • Flip-chip assembly
    • Pick and place
    • Bare die Integration
    • Solder reflow
    • Wafer/die thinning
    • COTS depackaging
    • COTS desoldering
    • BGA re-balling
    • WLP encapsulation
    • Epoxy molding
    • Injection molding
    • Photodefined solder mask
    • Under Bump Metallization (UBM)
    • Micro-solder ball grid array
    • Wafer dicing
    • Environmental/Burn-in
    • Bond strength testing

The MI team maintains a full production capability for printed circuit board (PCB) assemblies including passive components down to 0201 (Pilot production for 01005).  If you have system assembly requirements, please do not hesitate to contact us.  Usual turn-around is within 1 week, depending on complexity of the system.  We can readily re-ball commercial soldered parts to accommodate your operational needs at 40, 80, 125, and 350 micron ball diameters (other sizes possible with re-tooling).